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W-Ti Metal Sputtering Targets Planar Billet For Semiconductor Physical Vapor Depot

Categories Tungsten Metal Alloy
Brand Name: FGD
Model Number: fgd t-002
Certification: ISO9001, ISO14000
Place of Origin: China
MOQ: 50KG
Price: USD180-USD2800/KG
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 50 Metric Tons per Month
Delivery Time: 3-5 days
Packaging Details: WOODEN CASE
Shape: Customised
Chemical Composition: W
Relative Density (%): ≥99
Ra: ≤1.6
Application: thickness and smooth erosion
Product name: Ultra high purity material tungsten alloy w sputtering target
Purity (wt.%): 99.9%~99.995%
Grain Size: ≤50
Dimension (mm): ≤D.452
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W-Ti Metal Sputtering Targets Planar Billet For Semiconductor Physical Vapor Depot

Ultra high purity tungsten alloy W-Ti sputtering target Plate Planar Billet for Semiconductor Physical Vapor Deposition

Tungsten-titanium (WTi) films are known to act as the effective diffusion barrier between Al and Si in semiconductor and photovoltaic cells industry. WTifilms are typically deposited as thin films by physical vapor deposition (PVD) through sputtering of a WTialloy target. It is desirable to produce a target that will provide film uniformity,minimum particle generation during sputtering, and desired electrical properties. In order to meet the reliability requirements for diffusion barriers of complex integrated circuits, the WTialloy target must have high purity and high density.


Type

W

(wt.%)

Ti

(wt.%)

Purity

(wt.%)

Relative Density

(%)

Grain Size (µm)Dimension (mm)

Ra

(µm)

WTi-10901099.9-99.995≥99≤20≤Ø452≤1.6
WTi-20802099.9-99.99≥99≤20≤Ø452≤1.6
WTi70-9010-3099.9-99.995≥99≤20≤Ø452

≤1.6

Quality W-Ti Metal Sputtering Targets Planar Billet For Semiconductor Physical Vapor Depot for sale
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