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DDR RAM Thermal Pad

Categories Silicone Free Thermal Pad
Brand Name: AOK
Model Number: TP-200SF
Certification: RoHS, Reach, UL
Place of Origin: China
MOQ: 1000pcs
Payment Terms: T/T
Delivery Time: 13-15working days
Packaging Details: 400mmx200mm
Product Name: 10.0mm Thickness 2.9g/cc Density No Volatilization Silicon Free Thermal Pad
Thickness: 1.0~10.0 mm
Density: 2.9(g/cc)
Hardness: 45±5(Shore OO)
Breakdown Voltage: ≥6.0(kv/mm)
Thermal conductivity: 2.0±0.1(W/m.K)
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DDR RAM Thermal Pad

10.0mm Thickness 2.9g/cc Density No Volatilization Silicon Free Thermal Pad


AttributeValueTest Method
CompositionAcrylate-
ColorBlueVisual
Thickness(mm)0.5-10.0ASTM D374
Density(g/cc)2.9ASTM D792
Hardness(shore oo)45±5ASTM D2240
Usage Temperature(℃)-40~150--
Electrical
Breakdown Voltage(kv/mm)≥6.0ASTM D149
FlammabilityV-1UL94
Thermal
Thermal conductivity(W/m.K)2.0ASTM D5470

Product feature
■ Thermal conductivity:2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.

■ No siloxane volatilization

■ High thermal conductivity

■ High insulation

■ High compressibility


Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk

■ Optical precision equipment

■ Notebook computer, projector and OA office electronic products

■ Mobile and communication equipment, high-speed mass

■ Storage drives, heat pipe assemblies, automotive engine control equipment

■ Telecommunication hardware and equipment, high-end industrial control and medical electronics


Purchase information


Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


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