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FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver

Categories Multiple Layer PCB
Brand Name: ADMG
Model Number: OEM/ODM
Certification: ISO14001 ISO9001
Place of Origin: China
MOQ: 2pcs
Price: Negotiation
Payment Terms: L/C, D/A, D/P, T/T
Delivery Time: 5-8 working days
RoHS Compliance: Yes
Surface Mount Technology (SMT): Yes
Silkscreen: White, Black, Yellow, etc.
Solder Mask: Green, Red, Blue, Black, White, Yellow, etc.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, etc.
Material: FR-4, FR-4 High Tg, Polyimide, Rogers, etc.
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FR-4 Polyimide Advanced Multiple Layer PCB HASL ENIG OSP Immersion Silver

Multiple Layer PCB Introduction:

Multiple Layer PCBs, also known as multilayer printed circuit boards, are advanced electronic circuit boards that consist of more than two conductive layers. These intricate designs offer enhanced functionality, improved signal integrity, and increased component density compared to traditional single or double-layer PCBs.


Multiple Layer PCB Specifications:

Parameter

Description

Number of Layers4, 6, 8, or more
Copper Thickness0.5 oz to 2 oz per layer
Dielectric Thickness0.2 mm to 2 mm
MaterialFR-4, Rogers, Polyimide, etc.
Minimum Trace Width3 mil to 10 mil
Minimum Drill Size0.3 mm to 0.8 mm
Impedance Control50 Ω, 75 Ω, or custom
Surface FinishENIG, HASL, Immersion Gold, etc.
Solder MaskLiquid Photo Imageable (LPI), Dry Film
LegendSilk Screen, Laser Printed

Multiple Layer PCB Application Usage:

Multiple Layer PCBs are widely used in a variety of industries, including telecommunications, aerospace, automotive, industrial automation, and consumer electronics. These advanced circuit boards are essential for designs that require high-speed data transmission, increased component density, and complex interconnections.


Multiple Layer PCB Features:

  • Improved signal integrity and reduced electromagnetic interference (EMI) due to the shielding effect of the additional layers
  • Increased component density and more efficient use of board space
  • Enhanced thermal management capabilities
  • Ability to route critical signals on dedicated layers
  • Improved power distribution and ground plane design
  • Support for advanced technologies like high-speed digital, RF, and mixed-signal circuits

Product Advantages:

  • Enhanced functionality and performance compared to traditional PCB designs
  • Increased design flexibility and the ability to address complex circuit requirements
  • Improved reliability and durability due to the robust multi-layer construction
  • Cost-effective solution for high-volume production and complex circuit designs
  • Compatibility with a wide range of manufacturing processes and surface finishes

Request for Quotation (RFQ):

If you are interested in our Custom Tactile Membrane Switch, please provide the following information for a quotation:

  • Customization requirements, including size, shape, graphics, layout, and backlighting
  • Quantity needed
  • Application and industry details
  • Specific environmental considerations (e.g., waterproof or dustproof requirements)
  • Delivery time and location requirements
Quality FR-4 Polyimide Advanced Multiple Layer PCB  HASL ENIG OSP Immersion Silver for sale
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