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HAL Lead Free 1.62mm LED Solar Light PCB Board

Categories LED Light PCB Board
Brand Name: ACCPCB
Model Number: S1021
Certification: ISO,SGS,TS16949
Place of Origin: China
MOQ: 1 PCS
Price: Negotiable
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
Delivery Time: 3-5days
Packaging Details: Vacuum packing
Material: KB FR4
Count: 2layer
Surface Finish: HAL LEAD FREE
Application: solar equipment
Solder Mask: green
Copper thickness: 1 oz all layer
Min. hole size: 8 mil/6 mil
Min. line spacing: 4mil
Min. line width: 4mil
Service: Customized PCB
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    • Product Details
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    HAL Lead Free 1.62mm LED Solar Light PCB Board

    HAL Lead Free 1.62mm LED Light PCB Board For Solar Equipment


    Production description :

    this board is 2layer PCB it is used on solar equipment production. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.

    Key Specifications of LED solar PCB board​ :

    Production Types:

    Rigid PCB

    Layer :

    2 layer

    Base Material :

    ITEQ FR4

    Copper Thickness :

    1oz

    Board Thickness :

    1.62mm

    Min. Finish Hole Size :

    8 mil (0.20mm)

    Min. Line Width :

    4 mil

    Min. Line Spacing :

    4 mil

    Surface Finishing :

    HASL lead free

    Drilling hole tolerance:

    +/-3 mil ( 0.075mm )

    Min Outline tolerance :

    +/-4 mil ( 0.10mm )

    Working panel size :

    max:1200mmX600mm (47'' X24'')

    Outline profile:

    Punching, Routing , CNC routing + V-cut

    Solder mask :

    LPI Solder mask, Peelable mask

    Solder Mask Color :

    Blue, black,yellow, matte green

    Certificate :

    UL, CQC, TS16949, ISO14000, ROHS

    Silkscreen color :

    White

    Twist and Bow :

    no more than 0.75 %


    PCB Flow Chart.pdf


    Products Application:

    Our customized PCB is used in medical machinery field, aerospace field, automobile field, computer equipment, communication electronic equipment, military weapon system and so on.


    Technology Capability:

    ItemTechnical Parameters
    Layers1-28 Layers
    Inner Layer Min Trace/Space4/4 mil
    Out Layer Min Trace,Space4/4 mil
    Inner Layer Max Copper4 OZ
    Out Layer Max Copper4 OZ
    Inner Layer Min Copper1/3 oz
    Out Layer Min Copper1/3 oz
    Min hole size0.15 mm
    Max.board thickness6 mm
    Min.board thickness0.2mm
    Max.board size680*1200 mm
    PTH Tolerance+/-0.075mm
    NPTH Tolerance+/-0.05mm
    Countersink Tolerance+/-0.15mm
    Board Thickness Tolerance+/-10%
    Min BGA7mil
    Min SMT7*10 mil
    Solder mask bridge4 mil
    Solder mask colorWhite,black,blue,green,yellow,red,etc
    Legend colorWhite,black,yellow,gray,etc
    Surface finishHAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
    Board materialsFR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
    Impedance control+/-10%
    Bow and twist≤0.5

    FAQ :

    1. How do ACCPCB ensure quality?

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

    the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.



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