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FR4 TG150 double Layer PCB boards 1.6mm , OSP fininshing , 1/1OZ Copper Thickness

Categories Double Layer PCB
Place of Origin: Shenzhen, China
Brand Name: WonDa
Packaging Details: Vacuum bag + Outer carton
Number of Layers: double layer PCB
Base Material: FR4 TG150
Copper Thickness: 1/1OZ
Board Thickness: 1.6mm
Min. Hole Size: 0.35mm
Min. Line Width: 12mil
Min. Line Spacing: 16mil
Surface Finishing: OSP
solder mask color: green
silkscreen color: white
Certification: CE, ROHS, UL
MOQ: None
Price: Negotiable
Delivery Time: 5-15 days
Payment Terms: T/T, W.U, L/C
Supply Ability: 10000 Sq.meter/month
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    FR4 TG150 double Layer PCB boards 1.6mm , OSP fininshing , 1/1OZ Copper Thickness

    FR4 TG150 double Layer PCB boards 1.6mm , OSP fininshing , 1/1OZ Copper Thickness

    Specifications

    1.double layers PCB with OSP
    2.Base material: FR-4 based with TG150
    3.Board thickness:1.6mm


    NO MOQ

    1.2 layers PCB with OSP

    2.Base material: FR-4 based with TG150

    3.Board thickness:1.6mm

    4.Copper thickness:1 OZ

    5.Min line width :12mil

    6.Min line spacing: 16mil

    7.soldermask color: green

    8.low price and good quality.

    9.4-7days small order;8-15days mass order

    10.ISO9001, UL, ROHS,SGS complianted

    UL:E320045

    ROHS: A001C100827049001-2

    SGS: CANEC1000312001

    ISO9001:2000:110801011

    With 12 years experience We can do for you:


    1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB

    1-6 oz copper thickness

    0.2 mm hole size

    0.1 mm line width/space

    Our PCBs are used for wide range of electronic products,

    Like Inverter, Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box, Telecomunication ,LED, etc.


    Our Factory Manufacture Capability


    Item

    Manufacture Capability

    Material

    FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based

    Layer No.

    1-16

    Finished Board thickness

    0.2 mm-3.8mm’(8 mil-150 mil)


    Board Thickness Tolerance

    ±10%

    Cooper thickness

    0.5 OZ-6OZ (18 um-210 um)

    Copper Plating Hole

    18-40 um

    Impedance Control

    ±10%

    Warp&Twist

    0.70%

    Peelable

    0.012"(0.3mm)-0.02’(0.5mm)

    Images

    Min Trace Width (a)

    0.1mm (4mil)

    Min Space Width (b)

    0.1mm (4 mil)

    Min Annular Ring

    0.1mm (4 mil)

    SMD Pitch (a)

    0.2 mm(8 mil)

    BGA Pitch (b)

    0.2 mm (8 mil)


    0.05mm

    Solder Mask

    Min Solder Mask Dam (a)

    0.0635 mm (2.5mil)

    Soldermask Clearance (b)

    0.1mm (4 mil)

    Min SMT Pad spacing (c)

    0.1mm (4 mil)

    Solder Mask Thickness

    0.0007"(0.018mm)

    Holes

    Min Hole size (CNC)

    0.2 mm (8 mil)

    Min Punch Hole Size

    0.9 mm (35 mil)

    Hole Size Tol (+/-)

    PTH:±0.075mm;NPTH: ±0.05mm

    Hole Position Tol

    ±0.075mm

    Plating

    HASL

    2.5um

    Lead free HASL

    2.5um

    Immersion Gold

    Nickel 3-7um Au:1-5u''

    OSP

    0.2-0.5um

    Outline

    Panel Outline Tol (+/-)

    CNC: ±0.125mm, Punching: ±0.15mm

    Beveling

    30°45°

    Gold Finger angle

    15° 30° 45° 60°

    Certificate

    ROHS, ISO9001:2008, SGS, UL certificate



    Quality FR4 TG150 double Layer PCB boards 1.6mm , OSP fininshing , 1/1OZ Copper Thickness for sale
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